Junction Semiconductor
Dr. Devender
Director, Technology Development & Founder at Junction Semiconductor LLC
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About Dr. Devender
Dr. Devender is a semiconductor executive with over 12 years of experience leading technology development at Intel, Samsung, and Micron, and now founder of Junction Semiconductor LLC.He has driven innovations across 20+ consulting projects, authored 20+ technical papers, and holds 10+ patents in advanced lithography, memory, and 3D packaging. His work spans sub-2nm nodes, HBM/CXL systems, and AI/datacenter integration, with global impact across U.S., Korea, Taiwan, and Ireland ecosystems.If you're exploring advanced semiconductor solutions or seeking strategic insights across lithography, packaging, or AI infrastructure— Reach out to discuss how Junction Semiconductor can support your next breakthrough.
Advanced Semiconductor Technology & Lithography
EUV Lithography and High-NA Innovation: Analyzed ASML EUV roadmap, including High-NA deployment scenarios and alternative sub-EUV light sources (e.g., atom lithography, FEL). Quantified productivity, cost, and power scaling implications in GAA and 3D DRAM era.Advanced Lithography Technologies: Benchmarked LPP vs. LDP, evaluated overlay/metrology tradeoffs, and explored feasibility of alternative litho paths. Created roadmap visualizations for sub-2nm patterning.
Packaging, 3D Integration & Interconnect
2.xD/3D RDL and PLP Packaging: Evaluated RDL warpage, yield modeling, HRDP vs. SAP tradeoffs on 500mm+ substrates. Reviewed materials and process flow for molded RDL and panel-level packaging.CIS Packaging and Glass Cap Integration: Assessed CSP/WLCSP reliability tradeoffs, glass capping adoption. Compared resin vs. glass transmission, height constraints, and supplier ecosystem.Polyimide and Film Materials for Packaging: Studied PI thermal stability and delamination in molding/PLP. Modeled demand trends across memory, logic, CIS, and flexible electronics.
AI Infrastructure & Optical Networking
Optical DSP and Strategy Analyzed SerDes/AEC architecture adoption by hyperscalers. Compared LPO, CPO readiness, and packaging implications for GPU cluster scaling.MCP & Inference Infrastructure Modeling Built compute/memory/network architecture stack to support GenAI workloads. Explored emerging disaggregation protocols and monitoring strategies.
Memory & HBM Stack Analysis
HBM Technology Differentiation Compared TSV pitch, stack height, process yield, and underfill reliability. Benchmarked CXL and NVLink integration scenarios for future HBM/CXL hybrid memory pooling.Non-Volatile Memory Trends (FRAM, MRAM, ReRAM) Quantified scaling, endurance, and BEOL integration issues. Evaluated FRAM maturity vs. MRAM in embedded memory market.
Foundry Strategy, Yield & Fab Modeling
Foundry Race Analysis Created node roadmap timeline to 1.4nm, comparing gate pitch, BEOL scaling, and EUV insertion points. Integrated investment and technology cadence.Fabless-to-Foundry Transfer & Foundry Economics Modeled yield, equipment cost, and risk-sharing structure across TSMC, Samsung, Intel. Explored China foundry rise and onboarding implications.
Materials & Cross-Vertical Applications
Flexible Substrates, Sensors & MEMS Integration Explored lift-off MEMS, magnetic sensors, and laser alignment integration in low-temperature process stacks. Assessed carbon thin film and specialty glass applications.SiC MOSFET & Advanced Power Packaging Evaluated Through-Dielectric Interconnect (TDI) path to cost reduction. Mapped competitive structure for SiC-based automotive and datacenter components.